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High Frequency 2 Layer Communication PCB 1OZ 35um

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High Frequency 2 Layer Communication PCB 1OZ 35um

Place of Origin : Shenzhen,China

Brand Name : ONESEINE

Certification : ISO9001,ISO14001

Model Number : ONE-102

MOQ : 1pcs

Price : USD0.1-1000

Packaging Details : Vacuun bag

Delivery Time : 5-8 working days

Payment Terms : T/T,Western Union

Supply Ability : 1000000000pcs/mon

product_type : Communication PCB

material : High Frequency

layer_count : 2 layer

copper_weight : 1OZ

Min Line Width : 4mil

Mechanical Rigid : Rigid

Feature : Batch Customized Production

Copper Weight : 35um

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High Frequency Communication PCB Board Handling

PCB description:

Application Products: Power Amplifier

Number of layers: 2

Surface treatment: OSP

Material: ptfe f4b

PCB size:180*50mm

Outer line width/line spacing: 7/7mil

Inner line width/line spacing: 5/5mil

Board thickness: 2.3mm

Minimum aperture: 0.6mm

Precision High-Frequency PCBs for Mission-Critical Communication Systems

Demanding signal integrity in 5G, RF, and satellite applications? As your dedicated High Frequency PCB Factory, we specialize in manufacturing 1OZ copper Communication PCB Circuit Boards engineered for GHz+ performance.

Why Our PCBs Dominate Critical Communication Hardware:
✅ Ultra-Low Signal Loss: Rogers/Taconic laminates with Dk=2.0-10.6 & controlled ±1.5% impedance tolerance
✅ 1OZ Heavy-Copper Advantage: Enhanced current handling + thermal management for power amplifiers and base stations
✅ Strict Handling Protocols: ESD-controlled environment | Vacuum-sealed packaging | Moisture-sensitive component (MSD) compliance
✅ High-Frequency Expertise: 40+ layer builds | PTFE substrates | Laser-drilled microvias down to 0.1mm
✅ Rigorous Testing: TDR analysis | Insertion loss measurements | Time-domain reflectometry

Applications We Enable:
• 5G NR mmWave Antenna Arrays
• Satellite Communication Terminals
• Radar and Avionics Systems
• High-Speed Backplane Interconnects
• IoT Gateway RF Modules

Certified Reliability:
ITAR Registered | ISO 9001:2015 | IPC-6012 Class 3 | RoHS 3.0 Compliant

Via Design: Vias can impact signal integrity at high frequencies. High-frequency PCBs may use techniques like back drilling or buried vias to minimize signal reflections and maintain signal integrity across layers.
Component Placement: Careful consideration is given to component placement to minimize signal path lengths, reduce parasitic capacitance and inductance, and optimize signal flow.
Shielding: To minimize electromagnetic interference (EMI) and RF leakage, high-frequency PCBs may employ shielding techniques such as copper pours, ground planes, or metal shielding cans.
High-frequency PCBs find applications in various industries, including wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission.
Designing and manufacturing high-frequency PCBs require specialized skills, knowledge, and simulation tools to ensure the desired performance at high frequencies. It is often recommended to work with experienced PCB designers and manufacturers who specialize in high-frequency applications.
High Frequency 2 Layer Communication PCB 1OZ 35um
High Frequency 2 Layer Communication PCB 1OZ 35um

Product Tags:

35um HF PCB

      

small batch HF PCB

      

1OZ batch pcb

      
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